| 摘要 |
<p>PURPOSE:To prevent short circuit of adjacent end electrodes and to improve adhesion by baking a large laminate substrate having a conductor serving as an end electrode and dividing the large laminate substrate along a dividing groove provided crossing the conductor serving as the end electrode. CONSTITUTION:In a method of manufacturing a laminated circuit board, in which a wiring pattern 11 is arranged inside a laminate in which a plurality of ceramic layers 1a to 1g are built, and an end electrode 2 is formed on the end of the laminate, there is formed a large laminated board in an unbaked state having a conductor film serving as the internal wiring pattern 11 and having a conductor serving as the end electrode 2 formed in a through hole for the end electrode. Next, on this large laminate substrate, a dividing groove 5 is formed in a way to cross a conductor serving as the end electrode 2 to match the shape of the laminate. After the large laminated board is treated for baking, it is divided along the dividing groove 5.</p> |
