| 摘要 |
<p>PURPOSE:To realize a wiring board which is capable of mounting an integrated circuit part such as a flip chip or the like changing it in terminal pitch without increasing its cost. CONSTITUTION:The terminals of a flip chip 1 bonded by solder to the upside of a multilayer wiring board 5 formed of material nearly equal in thermal expansion coefficient to the flip chip 1 are changed in pitch and electrically connected to the underside of the wiring board 5. Therefore, if the multilayer wiring board 5 is mounted on a multilayer printed board 3, a flip chip can be changed in terminal pitch without causing cracking to a soldered joint. By this setup, an integrated circuit part such as a flip chip or the like can be converted in terminal pitch.</p> |
