| 摘要 |
<p>PURPOSE:To prevent contamination from occurring in a semiconductor wafer and to improve the yield of a chip by cooling a rotary blade and a part where the semiconductor wafer is ground by a low flow amount of grinding water, and then efficiently discharging the generated cut powder and injected grinding water. CONSTITUTION:A flange cover 10 for covering the rotary peripheral surface of a rotary blade 111 is constituted of an opening 11 which does not cover the delivery side of a dicing part 2 where grinding water and cut powder which scatter after the rotary blade grinds a semiconductor wafer, then a rectifying plate 20 is provided at the opening 11, the scattered grinding water, cut powder D, etc., are guided to the outside from the delivery side to be discharged.</p> |
