| 摘要 |
PURPOSE:To make a semiconductor package compact for assuring high reliability by a method wherein an outer connecting terminal pattern, when connected to a mother board surface for packaging, is mechanically and electrically reinforced by a laminated lead frame. CONSTITUTION:The semiconductor package and a circuit device are provided with a supporting substrate having a circuit part 2 including connecting terminal 2a on one main surface, a through hole connecting part 3 passing through the supporting substrate 1 in the thickness direction with one end thereof electrically connecting to the circuit part 2 and an outer connecting terminal pattern 4 integrally arranged on the other main surface of the supporting substrate 1 with at least one part electrically connected to the other end of the through hole connecting part 3. Besides, a lead frame 8 integrally and laminatedly arranged on the outer connecting terminal 4 in the form of sealing the throughhole 3a planarly led out for mechanical and electrical reinforcement. Through these procedures, the semiconductor package and circuit device easily made thinner and compact while assuring high reliability upon characterisrics and functional phase can be obtained. |
