发明名称 MANUFACTURE OF FLEXIBLE PRINTED WIRING BOARD
摘要 <p>PURPOSE:To realize a high performance flawless flexible printed wiring board having no surface defect by repeating a roll surface cleaning operation for passing a viscous film through the board film and metal foil pass line in a coater laminator. CONSTITUTION:A viscous roll 3 having cleaned surface is installed in a coater laminator 1 and a viscous film is fed from a board film feeding section 2 through a film pass line while a same kind of viscous film is fed tram a metal foil feeding section 12 through the film passline. A polyimide film is then coated, through a roll coater 4, with an epoxy/NBR based adhesive 5 and passed through an inline drier 8 where the solvent is removed and the adhesive is semi-cured before the polyimide film and an electrolytic copper foil are hot pressed. When a both-sided product thus produced is thermally hardened in a cure oven, foreign matters can be removed through combination of viscous roll and viscous film or through periodic running of viscous film thus realizing a board having good surface conditions stably.</p>
申请公布号 JPH0818196(A) 申请公布日期 1996.01.19
申请号 JP19940152335 申请日期 1994.07.04
申请人 SHIN ETSU CHEM CO LTD 发明人 EIKUCHI KICHIJI;KONISHI HISASHI;KURODA KOICHI
分类号 B32B15/08;B32B37/10;H05K1/03;H05K3/00;H05K3/38;(IPC1-7):H05K3/00;B32B31/20 主分类号 B32B15/08
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