| 摘要 |
PURPOSE:To enable a target light to accurately indicate a bonding spot always independent of a height difference in a work by a method wherein a pair of target lights is so positioned as to make their linear irradiation patterns form a crossing at the bonding spot of a work. CONSTITUTION:A wire bonding device carries out a bonding operation through such a manner that a bonding spot of a work 52 is positioned with a target light 50, and a capillary 17 which holds a wire is made to ascend or descend to apply a pressure and an ultrasonic output to a bonding spot for connecting a wire to a bonding spot, wherein a pair of target lights 50 is so positioned as to radiate linear irradiation patterns 51 like lines vertical to the direction of irradiation making them form a crossing at the bonding spot of the work 52. For instance, a semiconductor laser is used as a target light 50. |
