| 摘要 |
PURPOSE:To form a conductor layer by calcining a hollow dielectric in a reducing atmosphere. CONSTITUTION:An organic adhesive is added to the powdery mixture obtained by wet mixture and dehydration drying of powder of a (Zr.Sn)TiO4 and that of a nickel oxide in 9:1 by weight, and they are mixed and granulated. Obtained granules are loaded into a coaxial hollow square pillar and are pressed by 200kg/cm<2> to form a molding 1. The molding 1 has one end face, which corresponds to the open end, turned down and is closely put on the upper face 2, to which a zirconia oxide is melt-sprayed, and is set in the atmosphere, and thereafter, the organic adhesive is removed in two hours at 400 deg.C. Then, it is calcined in the same atmosphere in four hours at 1300 deg.C. Next, H2+N2 (20% H2 concentration) is charged into the atmosphere to form the reducing atmosphere, and it is subjected to heat treatment in two hours at 1100 deg.C, thus completing a dielectric 3 where an inner conductor layer 4, an outer conductor layer 5, a short-circuit conductor layer 6, and an inner peripheral hole 7 are formed in prescribed parts. |
