| 摘要 |
PURPOSE: To manufacture a bump applicable to an electrode of large area in a simple process, by providing, on an electrode part, a protruding body which is made of a substance having a small elastic modulus and a composite bump which is made by covering the protruding body with a metal film having a large elastic modulus and a proximate elastic coefficient. CONSTITUTION: In an oxide film on a silicon substrate 2 having a base diffusion region 3 and an emitter diffusion region 4 formed therein, a base aperture 5 and an emitter aperture 6 are opened. An Al-Si alloy is deposited thereon and photo-etching is carried out to form an Al electrode 7. Then, on the surface of the Al electrode 7 for forming a bump thereon, polyimide resin is accurately ejected and dropped from a nozzle and heat treatment is carried out to form a partly spherical protruding body 18. Subsequently, another Al-Si alloy is deposited and a second Al electrode 17 is photo-etched to form a composite bump 20. Finally, a nitride film 11 is deposited and patterned to protect a flat part of the second Al electrode 17. |
