发明名称 Verfahren zur Herstellung einer elektrischen Verbindung für eine integrierte Schaltung.
摘要 A method of forming solder stops (16,26) on a thick film, comprising a conductive metal and an inorganic oxide, including the step of directing a laser beam onto the film to form a surface consisting essentially of fused inorganic oxides which acts as a solder stop (16,26). <IMAGE>
申请公布号 DE69206579(D1) 申请公布日期 1996.01.18
申请号 DE1992606579 申请日期 1992.09.15
申请人 DELCO ELECTRONICS CORP., KOKOMO, IND., US 发明人 MYERS, BRUCE ALAN, KOKOMO IN 46901, US;COAPMAN, CHRISTINE REDDER, KOKOMO IN 46901, US;ISENBERG, JOHN KARL, ROSSVILLE IN 46065, US;BLANTON, JAMES ARTHUR, KOKOMO IN 46901, US
分类号 H01L21/48;H01L21/60;H01L23/498;H05K1/09;H05K3/22;H05K3/34;(IPC1-7):H01L21/60 主分类号 H01L21/48
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