发明名称 METHOD AND APPARATUS FOR THE APPLICATION OF LIQUID MATERIALS ONTO SUBSTRATES
摘要 A method and apparatus for application of heat curable liquid (15) onto substrates is provided. The present invention allows high speed selective application of curable liquid (15) to a continuous succession of discrete substrates (74) disposed on a conveyor belt (18). Each substrate (74) is stabilized on the conveyor belt (18) via a stationary magnetic device (42), liquid applicator guns (30) are adjusted along a desired axis in relation to each substrate (74), heat curable liquid is applied, and each coated substrate is cured via heating device (54) in order to form a solid or foamed coating on at least a portion of each substrate. The present invention provides increased speed efficiency and adherence of the liquid cured onto the substrates.
申请公布号 WO9601155(A1) 申请公布日期 1996.01.18
申请号 WO1995US08492 申请日期 1995.07.05
申请人 ND INDUSTRIES, INC. 发明人 WALLACE, JOHN, S.
分类号 B05C5/02;B05C9/14;B05C13/02;B05D7/14;B29C41/20;(IPC1-7):B05C5/00;B05B12/00;B05D3/02;B29C35/00;B65G23/18 主分类号 B05C5/02
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