摘要 |
A method and apparatus for application of heat curable liquid (15) onto substrates is provided. The present invention allows high speed selective application of curable liquid (15) to a continuous succession of discrete substrates (74) disposed on a conveyor belt (18). Each substrate (74) is stabilized on the conveyor belt (18) via a stationary magnetic device (42), liquid applicator guns (30) are adjusted along a desired axis in relation to each substrate (74), heat curable liquid is applied, and each coated substrate is cured via heating device (54) in order to form a solid or foamed coating on at least a portion of each substrate. The present invention provides increased speed efficiency and adherence of the liquid cured onto the substrates.
|