| 摘要 |
In order to manufacture a three-dimensional circuit, the invention calls for two substrates (21, 26) to be placed one on top of the other, the surfaces of the substrates in contact with each other already being fitted with devices. The substrates (21, 26) are rigidly joined to each other by these surfaces (22, 27). One (21) of the substrates is subsequently reduced in thickness from the rear (212) and fitted with rearside contacts (213), the other substrate (26) acting as a support plate providing stability. |
