| 摘要 |
A plastic encapsulated integrated circuit package is disclosed herein. This IC package (24) includes a lead frame (12) having an IC attachment pad, a lead chip, or other suitable means (14) for supporting an IC chip, a plastic molding encapsulating (26) the IC pad and chip (16), and spaced-apart but adjacent electrically conductive leads (28) forming part of the lead frame and extending out from the plastic molding (26). The lead frame also includes an electrically conductive dambar (30) extending across the leads (28) at points adjacent to and just outside the plastic molding (26). This particular dambar (30), as disclosed, includes initially formed through-slots (32) between adjacent ones of the leads (28), that is, through-slots (32) that are provided before the package is encapsulated with plastic. This through-slotted dambar (30) is especially designed for use with a fine pitched IC package and functions in the normal plastic damming manner, notwithstanding its through-slots (32) which are sufficiently large to receive the following plastic as the package is encapsulated but small enough to prevent the plastic from flowing beyond the dambar (30). |
