SEMICONDUCTOR BODY, ITS MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE USING THE BODY

摘要

A semiconductor body (20) has a first and a second element formation surface. The semiconductor body (20) is constructed in such a manner that a first semiconductor substrate (10), which has a first main surface at which the (100) plane appears, is laminated to a second semiconductor substrate (12), which has a second main surface at which the (110) plane appears. Made in the first semiconductor substrate (10) is at least one opening (18) at which is the second main surface of the second semiconductor substrate (12). The first main surface of the first semiconductor substrate (10) becomes the first element formation surface of the semiconductor body (20), and the second main surface of the second semiconductor substrate becomes the second element formation surface of the body (20).