| 摘要 |
PURPOSE:To provide the title compsn. having excellent mechanical and electrical properties, melt moldability, heat resistance, anti-foaming properties and anti- stick inhibiting properties, consisting of a polyamide-imide resin, a thermoplastic resin and a fluororesin. CONSTITUTION:10-30vol% fluororesin (e.g. tetrafluoroethylene/hexafluoro propylene copolymer) having a specific melt viscosity if 1X10<3>-10<6>P at 372+ or -1 deg.C and a m.p. of 250 deg.C or above (in the crystalline form) is blended with a mixture of 60-90vol% polyamide-imide resin of formula I (wherein R1 is a trivalent arom. group cong. at least one benzene ring; R2 is a bivalent org. group; R3 is H, methyl, phenyl) and 40-10vol% at least one thermoplastic resin selected from among arom. polysulfonic acids having a decomposition temp. of 350 deg.C or above, a specific melt viscosity of 1X10<3>-10<5>P at 350+ or -1 deg.C and formula II (wherein R<4> is a bivalent arom. group) and arom. polyether ketone resin of formula III. |
