Manufacturing one sided resin sealed semiconductor devices and a carrier used for it

摘要

A one sided resin sealed type semiconductor device has a semiconductor element (20) which is mounted on one side of a circuit board (10). Wiring patterns are provided on both sides of the circuit board (10). The semiconductor element (10) mount portion is sealed with resin (29). External connecting terminals, such as solder balls (30), are joined to the wiring pattern on the other side of the circuit board (10). The method of manufacturing such devices includes the steps of: positioning and disposing the circuit board (10) formed into an individual piece in register with a through-hole (13) formed in a rectangular carrier frame (12); and conveying the circuit board (10) supported by the carrier frame (12) through a series of processing steps such as mounting the semiconductor element (10), electrically connecting the semiconductor element (20) with the wiring pattern on the circuit board (10), sealing the semi-conductor element mount portion with resin (29), and connecting the wiring pattern on the other side of the circuit board (10) with the external connecting terminals (30). $$