| 发明名称 |
RESIN IMPREGNATED LAMINATE FOR WIRING BOARD APPLICATIONS |
| 摘要 |
Dimensionally stable resin impregnated laminates for printed wiring board applications are reinforced with from 43 to 57 weight percent of nonwoven aramid sheet having a coefficient of thermal expansion of less than 10 ppm per DEG C, a basis weight of from 0.8 to 4.0 oz/yd2, a density of from 0.5 to 1.0 g/cc and a Gurley Hill Porosity of less than 10 sec. |
| 申请公布号 |
EP0692177(A1) |
申请公布日期 |
1996.01.17 |
| 申请号 |
EP19940912846 |
申请日期 |
1994.03.28 |
| 申请人 |
E.I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
KIRAYOGLU, BIROL;SULLIVAN, WILLIAM, JOHN;ZUSSMAN, MELVIN, PAUL |
| 分类号 |
C08J5/24;B32B27/04;D04H1/42;D21H13/26;H05K1/03 |
主分类号 |
C08J5/24 |
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