Method and apparatus for etching film layers on large substrates

摘要

A chamber (10) for processing substrates (12) includes a support member (14) therein which is suspended from a sidewall of the chamber. The support member includes multiple planar faces (30) for receiving substrates thereon, and is rotatable by a drive member (16) through a coupling (34) about a horizontal axis to position the multiple planar faces in a horizontal position (Fig 2) to place the substrates on the planar faces or remove the substrates from the planar faces, and a second position to place the substrates in a non-horizontal position (Fig 3) for processing. A clamping and lifting apparatus (32) is provided on the support member. The clamping and lifting apparatus is positionable, with respect to the support member, in an extended position to permit a substrate to be positioned between the clamping and lifting assembly and the support member, and in a retracted position to clamp the substrate to the support member. A clamp actuator (200) is disposed on the chamber wall to move the clamping and lifting assembly (32) between the extended and retracted positions. $$ $$