| 摘要 |
PURPOSE:To surely and easily hold a material to be polished during polishing when the material to be polished such as a semiconductor wafer is rotationally polished and to sufficiently apply an abrasive material such as abrasive liquid on the surface to be polished during polishing so as to prevent insufficient polishing or uneven polishing. CONSTITUTION:When a material 1 to be polished is pressed onto a grinding disc so as to be rotationally polished while using abrasive liquid or the like, a polishing device is provided with a ringed holding part 4 (link guide), which framingly surrounds the circumference of the material l to be polished such as a semiconductor wafer so as to hold it, and grooves 5 for letting an abrasive material flow in are intermittently, for example, formed in the holding part 4. |
