Semiconductor laser device encapsulated in a transparent resin layer

摘要

A semiconductor laser includes a sealing resin portion with a flat portion covering a main portion of an LD element and a flange portion integrally molded with the flat portion and covering connecting leads on their terminal side. The top and bottom surfaces as well as the side faces of the flat portion are arranged symmetrically with respect to the center of the the connecting leads. The outer periphery of the flange portion has a curvature of a virtual cilcle which has a center of the laser beam emitting point of the LD chip. The virtual circle is determined to have the curvature so that the flange portion can be mounted onto an optical apparatus. The symmetrical arrangement of the flat portion suppresses displacement of the laser beam emitting point caused by thermal stress and the flange portion facilitate mounting of the semiconductor laser device in the same way as the conventional can-type semiconductor laser device.