Method and apparatus for inspecting bent portions in wire loops

摘要

In inspecting a bend of a wire which is bonded to, for example, a semiconductor device, a straight scale line with scale markings of constant intervals and a bonded-point line, both lines crossing each other at right angles, are shown on a monitor. An image of a wire that has a bend is monitored by a camera and displayed on a monitor. By overlapping the image of the bend of the wire on the scale line and then reading a scale marking which is closest to the bend of the wire, it is possible to ascertain the amount of the bend of the wire.