发明名称 |
Heat-sealable connector and method for the preparation thereof |
摘要 |
Proposed is an improved heat-sealable connector having aligned lines of an electroconductive paste formed by screen printing on the surface of a flexible substrate. Different from conventional heat-sealable connectors, the electroconductive lines are not formed directly on the surface of the substrate but the substrate surface is first provided with a layer of a solvent-absorptive material and the electroconductive lines are formed on the solvent absorptive layer by screen printing so that the screen-printed lines of the paste never cause running to broaden the line width by virtue of immediate absorption of the solvent in the paste into the solvent-absorptive layer to contribute not only to the productivity but also to the quality of the product connectors.
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申请公布号 |
US5484648(A) |
申请公布日期 |
1996.01.16 |
申请号 |
US19930105731 |
申请日期 |
1993.08.11 |
申请人 |
SHIN-ETSU POLYMER CO., LTD. |
发明人 |
ODASHIMA, SATOSHI;YOSHIDA, KAZUYOSHI |
分类号 |
H01R4/04;H05K1/00;H05K3/12;H05K3/32;H05K3/38;(IPC1-7):B32B9/00 |
主分类号 |
H01R4/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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