发明名称 Silicon thin film member
摘要 A silicon thin film member according to the present invention comprises a supporting substrate and an a-Si thin film formed by plasma CVD and including hydrogen. The a-Si thin film has a distribution of hydrogen density in which a hydrogen content of the a-Si thin film has a maximum value of 1x1022 atoms/cm3 or more in a position 20 nm or less away from an interface between the a-Si thin film and the supporting substrate, and the maximum value of the hydrogen content is larger than a hydrogen content of the supporting substrate on the interface. The hydrogen content of the a-Si thin film decreases from the position toward the interface and decreases from the position in a direction from the supporting substrate to the a-Si thin film.
申请公布号 US5484658(A) 申请公布日期 1996.01.16
申请号 US19940350144 申请日期 1994.11.29
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 IHARA, HISANORI;NOZAKI, HIDETOSHI
分类号 C04B41/50;C04B41/85;C23C16/22;C23C16/24;C23C16/505;H01L21/205;H01L21/331;H01L21/336;H01L29/78;H01L29/786;H01L29/861;H01L31/04;H01L31/20;(IPC1-7):B32B17/06 主分类号 C04B41/50
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