发明名称 |
Silicon thin film member |
摘要 |
A silicon thin film member according to the present invention comprises a supporting substrate and an a-Si thin film formed by plasma CVD and including hydrogen. The a-Si thin film has a distribution of hydrogen density in which a hydrogen content of the a-Si thin film has a maximum value of 1x1022 atoms/cm3 or more in a position 20 nm or less away from an interface between the a-Si thin film and the supporting substrate, and the maximum value of the hydrogen content is larger than a hydrogen content of the supporting substrate on the interface. The hydrogen content of the a-Si thin film decreases from the position toward the interface and decreases from the position in a direction from the supporting substrate to the a-Si thin film.
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申请公布号 |
US5484658(A) |
申请公布日期 |
1996.01.16 |
申请号 |
US19940350144 |
申请日期 |
1994.11.29 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
IHARA, HISANORI;NOZAKI, HIDETOSHI |
分类号 |
C04B41/50;C04B41/85;C23C16/22;C23C16/24;C23C16/505;H01L21/205;H01L21/331;H01L21/336;H01L29/78;H01L29/786;H01L29/861;H01L31/04;H01L31/20;(IPC1-7):B32B17/06 |
主分类号 |
C04B41/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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