| 摘要 |
PURPOSE:To obtain a die bonding device wherein any failure is hardly generated than heretofore by providing an electromagnet that allows a die pad and inner lead consisting of magnetic material to be attracted onto the surface of a heat adapter by its magnetic force during wire bonding. CONSTITUTION:Once a lead frame 4 is transferred to a specified position, a heat adapter 13 left in a lower position is moved upward until the surface thereof is brought into contact with the face of the frame 4. In such a state where it is positioned, a switch SW is turned on and a current is made to flow through a coil 12. Thus, an iron core 11 and coil 12 are formed into an electromagnet and a magnetic force is generated, then a die pad and inner lead are attracted to the surface of the adapter 13, so that they are tightly fixed thereon. At this time, since the die pad and inner lead and the adapter 13 are fixed with each other with no clearance, a wire can be bonded in a proper state. |
