| 摘要 |
<p>PURPOSE:To provide a multilayer wiring board where the inductance component of a connecting member is eliminated. CONSTITUTION:Transmission lines 6 and 7 and a grounding electrode 8 are formed on the upside and underside of a multilayer board 1 respectively, and a circuit device 2 fitted with an input electrode 3, an output electrode 4, and a grounding electrode 5 is formed inside the multilayer board 1. A gap 1a is provided between the transmission lines 6 and 7 of the multilayer board 1 and the electrodes 3 and 4 of the circuit device 2 and between the grounding electrode 5 of the circuit device 2 and the grounding electrode 8 of the multilayer board 1 respectively, whereby the transmission lines 6 and 7 and the grounding electrode 8 of the multilayer board 1 and the electrodes 3 and 4 and the grounding electrode 8 of the circuit device 2 are electromagnetically coupled together through the intermediary of the gaps 1a.</p> |
