| 摘要 |
PURPOSE:To enhance reliability of a multichip semiconductor device module. CONSTITUTION:The semiconductor device comprises a ceramic board 51, a thin film multilayer board 52, a bare chip, and leads 55 for mounting. The thin film multilayer board 52 comprises a board body 70, and a thin film multilayer wiring layer 71. The thin film multilayer wiring layer 71 comprises insulating layers 73-1..., 73-3, a wiring pattern 74, a via structure part 75, and a decoupling capacitor 72. The insulating layer 73-1,...,73-3 has smooth surface and comprises an insulating layer body of resin mixed with a photosensitive substance, and a BOB insulating layer covering the insulating layer body. The via structure part 75 has such structure as the vias are not superposed each other but shifted from each other. The decoupling capacitor 72 has a structure of a pair of interdigital electrodes. |
