| 摘要 |
PURPOSE:To obtain visual inspection method for electronic device by which a solder bridge between the electrodes of an electronic device mounted on a board can be inspected optically and automatically. CONSTITUTION:A two electrode rectangular electronic device 73 is observed by means of a camera and scanning lines 79, 79a, 79b are set between the electrodes in order to inspect a solder 78 present on the scanning line 79, 79a or 79b. If a solder 78 is found, a decision is made that a solder bridge is present thus deciding that the soldered state is not acceptable. |
