| 摘要 |
PURPOSE:To provide a semiconductor device wherein, with a tab omitted, a pellet is fixed in the wire bonding process and the resin sealant forming process. CONSTITUTION:With holding wires 9 bridged between a lead 7 which is different from an inner lead 5 and a pellet 8, the pellet 8 is held inside a resin sealant 11. The holding wires 9 are wired to the four corners of the pellet 8, while bridged, at low arch, with alminum wire material of high rigidity by ultrasonic bonding method. Since a tab is omitted, the effect of thermal stress due to thermal expansion factor difference is restrained in contrast to when a metal tab exists between the pellet and resin sealant, thus, cracking of the resin sealant is prevented. At wire bonding operation and forming operation of the resin sealant, the pellet is held with the holding wire, so, the movement of the pellet is prevented. |
