| 摘要 |
PURPOSE:To provide an IGBT module of high reliability by suppressing development of cracking of the wire on an electrode pad while running. CONSTITUTION:An IGBT module contains an average crystal grain size of more than 50mum in connection between an element 3 and an external electrode 1, and, so that no recrystallization take place at conduction, it consists of an aluminum wire containing Fe of 0.02-1wt.% so that recrystallization temperature is raised to 150 deg.C or above. Thus, an IGBT module of high reliability with no possible wire peel. |
