SUBSTRATE TREATING SYSTEM

摘要

PURPOSE:To prevent transmission of heat from a heat treating section to a non-heat treating section at the time of circulation transfer of a substrate to be treated. CONSTITUTION:Semiconductor wafers are circulated through a first treating section group 110 including a hot plate and a second treating section group 120 including no hot plate and treated sequentially at each treating section. A high temperature robot TH for gaining access to the first treating section group 110 is provided independently from a low temperature robot TC for gaining access to the second treating section group. The semiconductor water IS delivered between two robots TH, TC through a delivering section 140 utilizing a cool plate. Since the low temperature robot TC is not subjected to heat, the temperature stability is sustained at the non-heat treating part even if the low temperature robot gains access to a non-heat treating section in the second treating section group 120.