| 摘要 |
PURPOSE: To obtain a metallurgical stability of an integrated circuit when ball bond wired are connected to bond pads. CONSTITUTION: Au or Cu ball bond wires 18 are connected to Al bond pads 14 by the method comprising steps of forming an electrically connecting Pd layer 16 on the bond pads 14, connecting the ball bond wires 18 to this layer 16 to electrically connect the pads 14 to the wires 18, thereby preventing undesired extra stress or lift due to an intermetallic compd. produced from the direct connection of the pads 14 to the wires 18. |
