MANUFACTURE OF IC CARD AND IC CARD

摘要

PURPOSE: To reduce a process for manufacturing an IC card. CONSTITUTION: An insulating card supporting member 1 provided with a cavity 5 for storing an integrated circuit 4 is provided. A metallic contact pad 2 connected to the contact point of the integrated circuit is provided on the face. Conductive tracks 8 and 9 which are arranged at the bottom 7 and the side wall 6 of the cavity 5 and are connected to one pad 2 arranged on the face of the supporting member 3 having the cavity 5 are formed by formation mutual connection element MID technology. The contact point of the integrated circuit 4 arranged on the cavity 5 is connected with the conductive track 9 of the bottom 7 of the cavity by using a conductor 12. Then, the cavity 5 is buried by using polymerized protection resin 13.