发明名称 METHOD OF FABRICATING EPITAXIAL WAFER FOR LIGHT EMITTING DIODE
摘要 PURPOSE:To control an influence of defective part on a substrate surface to realize epitaxial growth of a high quality p-type layer and n-type layer on a GaAs substrate crystal. CONSTITUTION:On the occasion of sequential liquid phase epitaxial growth of p-type Ga1-xAlxAs layer and n-type Ga1-xA fx. As layer on a GaAs substrate crystal, the Ga solution for growth of p-type Ga1-xAlxAs layer is maintained at the temperature which is higher than that for saturably solving Al and As by 1 to 10 deg.. After the GaAs substrate crystal is placed in contact with the Ga solution, the Ga solution is gradually cooled so that the p-type Ga1-xAlxAs layer grows at the surface of the GaAs substrate crystal. Thereby, since a high quality p-type layer is formed without reflecting a fault at the substrate surface, a light emitting diode which provide a higher light emitting output can be obtained.
申请公布号 JPH088199(A) 申请公布日期 1996.01.12
申请号 JP19940163041 申请日期 1994.06.22
申请人 NISSHIN STEEL CO LTD 发明人 OMURO AKIO;NOMURA SHIGEHIKO;KAJIMOTO ATSUSHI;TOMIZUKA YUJI;OKI KAZUHIRO;YAMASHITA SEIJI
分类号 H01L21/208;H01L33/20;H01L33/30;H01L33/40 主分类号 H01L21/208
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