| 摘要 |
<p>PURPOSE:To eliminate the defect of formation of the part remaining without being developed which is generated by the air bubble sticking to a resist film surface as a result of bubble inclusion, etc., at the time of dropping a developer to a substrate to be treated in resist development used for semiconductor production or color filter production, etc. CONSTITUTION:This device has a rotary chuck 7 which attracts the substrate 1 to be treated by vacuum and rotates the substrate, a vacuum deaerator 12 which forms deaerated pure water by vacuum deaeration of the pure water, a deaerated pure water dropping nozzle 13 which forms a liquid build-up by dropping the deaerated pure water onto the resist film 2 of the substrate 1 to be treated and a developer dropping nozzle 4 which substitutes the deaerated pure water build-up 14 with the developer. This method for developing the resist comprises forming the deaerated pure water build-up on the substrate l to be treated prior to development of the resist film and absorbing the air bubble sticking onto the resist film to the deaerated pure water, then substituting the deaerated pure water with the developer without bringing the pure water into contact with the air.</p> |
