| 摘要 |
PURPOSE:To obtain an aligning device with which solder balls can be aligned accurately, and productivity can be improved. CONSTITUTION:The title aligning device is provided with a container 11, wherein a number of solder balls 4 are stored, and an arrangement plate 12 on which a plurality of recessed parts 12b, which receive the solder balls 4 and provided under the above-mentioned container and arranged on the prescribed pattern in such a manner that a solder ball 4 is inserted by engaging into a solder-ball receiving surface 12a. An aligning plate 12, with which the receiving surface 12a can be moved to outside the container, is provided. |
