| 摘要 |
<p>PURPOSE:To strip an adhesive sheet easily from a chip device by a structure vacuum sucking the adhesive sheet to the stage surface where protrusions and recesses are repeated periodically in two directions at substantially the same interval as that of the chip device. CONSTITUTION:The stage unit being employed for stripping an adhesive sheet from a chip device 3 comprises a mounting stage 12A and a vacuum suction means 12B. The stage 12A has a stage surface where protrusions and recesses are repeated periodically at a substantially the same interval as that of the chip device 3. The vacuum suction means 12B sucks the adhesive sheet to the stage surface and deforms the adhesive sheet along the protrusions and recesses so that the chip device 3 can be stripped easily from the adhesive sheet. Consequently, the chip device 3 can be stripped easily from the adhesive sheet by partially stripping the chip device 3, on the rear side thereof, from the adhesive sheet.</p> |
