| 摘要 |
PURPOSE:To obtain a heat sink in which a minimum heat dissipation performance is ensured even upon occurrence of solder crack during heat shock test, for example, by preventing the crack from spreading. CONSTITUTION:A circuit pattern 12 of copper foil is bonded onto a wiring board 11. A high power semiconductor element 13 is connected electrically with the circuit pattern 12 through leads 14 by TAB mounting method. A pattern 15 of copper foil is formed on the rear side of the wiring board 11. The rear pattern 15 is provided with an unsoldered part 16 and separated into an outer peripheral rear pattern 15a and a rear pattern 15b in the unsoldered part 16 including the part immediately below the semiconductor element 13. The wiring board 11 is then soldered 18 to the heat sink base 17 fixed to the heat sink 20 by means of screws 19. |
