| 摘要 |
PURPOSE:To provide a method for inspection, which automatically confirm the presence of electronic parts mounted on a substrate by means of a chip mounter. CONSTITUTION:A method for inspecting electronic parts includes a step in which the picture data about luminance are collected from an area to be inspected by observing the upper surfaces of electronic parts P1-P4 mounted on a substrate 11 with a camera 14, a step in which the number of lumps having different backgrounds and luminance is found in the area to be inspected, and a step in which the presence/absence of the parts P1-P4 is discriminated based on that whether or not the number of lumps coincides with a set value. |
