| 摘要 |
PURPOSE: To package an image sensor to a size adapted to the medical application by forming an UV hardening adhesive on a die in the top face of a lead frame, hardening it to a specified shape, charging it with this adhesive, and irradiating it with an UV ray through a cover glass to fix this glass to the adhesive. CONSTITUTION: The method comprises fixing a die 12 to the top face of a conductive lead frame 14, electrically connecting the die 12 to the leaf frame 14, forming an optically transparent UV hardening adhesive 24 in the die 12, hardening the adhesive 24 so that the adhesive 24 on the die has a recessed top face, charging an UV hardening adhesive 26 in the recessed face, putting a cover glass having a refractive index adapted to the adhesive 26 thereon, irradiating it with an UV ray through a cover glass 28 to fix the glass 28 to the adhesive 26, thereby obtained a package adapted to medical imaging requirements. |
