CONSTRUCTION METHOD OF IC CARD AND IC CARD

摘要

PURPOSE: To use an integrated circuit in which the number of processing processes in the construction of an IC card is reduced and which can widely be used in terms of commerce on installation into the card, namely, the integrated circuit which does not require excess metal thickness in a contact point. CONSTITUTION: A cavity 5 designed to store the integrated circuit 4 is provided for a card supporting member 1. An inner metal contact point pad 9 which is electrically connected to an outer metal contact point pad 2 is provided at the bottom 7 of the cavity 5. The inner pad 9 is connected with the outer pad 2 arranged on a face 3 having the cavity 5 by a metallic layer 8 on the wall 6 of the cavity 5. Electric connection between the inner pad 9 and the metal pad in the circuit 4 is established by the installation of the flip chip of the circuit by adhesion using anisotropic conductive adhesive 36 under precise temperature and pressure.