UNSATURATED POLYESTER RESIN COMPOSITION AND PROCESS FOR MOLDING SAID COMPOSITION

摘要

An unsaturated polyester resin molding composition comprising 100 parts by weight of an unsaturated polyester resin (A), 20-120 parts by weight of a thickening agent (B) containing a powdery thermoplastic resin as the active ingredient, 30-120 parts by weight of a liquid polymerizable monomer (C) and a curing agent (D); SMC and BMC prepared by compounding the above composition with a reinforcement (E); and a process for low-temperature and low-pressure molding of the SMC and BMC. The resin composition can provide SMC in a short time, and the obtained SMC has a good storage stability, is moldable at low temperature and pressure, and can provide a molding having a lowered shrinkability, and excellent surface smoothness and large strength and modulus of elasticity.