发明名称 Substrate anodic bonding electrode arrangement
摘要 The electrode arrangement a disc-shaped substrate, e.g. glass, silicon, an electrode carrier (1), and at least two electrodes (3). The substrate is connected to a voltage source to form a voltage potential between the substrate and another disc-shaped substrate. The two electrodes are joined to the electrode carrier and contact the substrate approx. at a point. The electrodes are mechanically movable independently of one another in a direction mainly normal to one substrate plane.
申请公布号 DE4423164(A1) 申请公布日期 1996.01.11
申请号 DE19944423164 申请日期 1994.07.04
申请人 KARL SUSS DRESDEN GMBH, 01561 SACKA, DE 发明人 TEICH, MICHAEL, DIPL.-PHYS., 01468 FRIEDEWALD, DE;MAREK, PETER, DIPL.-ING., 01129 DRESDEN, DE;SCHMIDT, AXEL, DIPL.-ING., 01558 GROSENHAIN, DE
分类号 H01L21/58;(IPC1-7):H01L21/58;H01L21/60;H01R43/02 主分类号 H01L21/58
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