STRUCTURE AND FABRICATION OF ELECTRON-EMITTING DEVICES

摘要

In one electron-emitting device, non-insulating particle bonding material (24) securely bonds electron-emissive carbon-containing particles (22) to an underlying non-insulating region (12). The carbon in each carbon-containing particle is in the form of diamond, graphite, amorphous carbon, or/and silicon carbide. In another electron-emitting device, electron-emissive pillars (22/28) overlie a non-insulating region (12). Each pillar is formed with an electron-emissive particle (22) and an underlying non-conductive pedestal (28). Various techniques, including use of electron-emissive particles as etch masks in the case of the pillared electron emitter, are employed in fabricating the electron emitters.