Halbleiterspeichersteuerung und Methode zur Montage in hoher Dichte.

摘要

A semiconductor memory control device comprises a flexible board 7 which is folded in such a manner as to form a stack; a plurality of semiconductor elements 10 mounted on the flexible board; and a package main body 6, 8, 9 which encloses and seals the flexible board and the plurality of semiconductor elements. A method of mounting semiconductor memory control devices in high density comprises the steps of: mounting a plurality of semiconductor elements on a flexible board; forming an internally mounted module by bending the flexible board in such a manner as to be stacked in multiple layers; and sealing the internally mounted module in a package's main body.