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发明名称
Verfahren zum flächenhaften Verbinden von Siliziumhalbleiterscheiben.
摘要
申请公布号
DE59204451(D1)
申请公布日期
1996.01.11
申请号
DE19925004451
申请日期
1992.01.09
申请人
TEMIC TELEFUNKEN MICROELECTRONIC GMBH, 74072 HEILBRONN, DE
发明人
SCHUSTER, GUENTHER, DR., W-7325 BAD BOLL, DE;PAENITSCH, KLAUS, W-7312 KIRCHHEIM, DE
分类号
H01L21/18;H01L21/52;(IPC1-7):H01L21/18
主分类号
H01L21/18
代理机构
代理人
主权项
地址
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