Generation of test program for checking solder pad data on circuit boards

摘要

A computer aided design process converts an electronic circuit design into a printed circuit layout that includes interconnection tracks and soldered connection point for surface mounted devices. The solder is deposited at the designated points using a printing process and the board is checked by an automatic optical scanning process that provides data for comparison with reference data. The reference data for the location of solder pads is defined within the computer aided design program and this is filtered out from the main body of data.