| 发明名称 |
PACKAGE FOR ELECTRONIC ELEMENT |
| 摘要 |
<p>A package for hermetically housing an electronic element has a lid made of metallic foil. The gap between the lid and the main body is sealed with a resin adhesive. <MATH></p> |
| 申请公布号 |
EP0691680(A1) |
申请公布日期 |
1996.01.10 |
| 申请号 |
EP19950906488 |
申请日期 |
1995.01.19 |
| 申请人 |
NIPPON CARBIDE KOGYO KABUSHIKI KAISHA |
发明人 |
KAWAURA, SHIGEHIRO |
| 分类号 |
H01C1/02;H01G4/224;H01L23/02;H01L23/04;H01L23/10;H03H9/02;H03H9/10;(IPC1-7):H01L23/04 |
主分类号 |
H01C1/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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