<p>Chip-type electronic elements are applied in line on the surface of a carrier tape before they are supplied to an automatic electronic-element supply apparatus so as to be then automatically mounted on a printed circuit board. Side plates are disposed at an end portion of the body frame of the automatic electric element supply apparatus for a chip-type electronic element mounting apparatus in such a manner that a plurality of carrier tape reels can be fastened to the side plates and the carrier tapes are discharged from the tape reels in a ratchet manner while moving adjacently in parallel to one another through another end portion of the body frame. Thus, a multiplicity of kinds of electronic elements can be supplied from one supply apparatus. <IMAGE></p>
