发明名称 METHOD AND DEVICE FOR FILM INSERT MOLDING
摘要 PURPOSE:To perform molding by a method wherein film or the like is surely brought into close contact with the set position of a mold through no manpower. CONSTITUTION:After the uppermost film F of a film feeding device 4 is held by sucking air under the state that a chuck device 5 is shifted to the film feeding device 4, the chuck device 5 is shifted to an electrifying device 6 so as to give static electricity to the suckingly held film. Next, after the chuck device 5 is shifted to one opened mold 22, the suckingly held film F is pressed against the mold 22 by evacuating air so as to bring the film into close contact with the mold by means of static electricity.
申请公布号 JPH081717(A) 申请公布日期 1996.01.09
申请号 JP19940142929 申请日期 1994.06.24
申请人 SEKISUI CHEM CO LTD 发明人 KURODA MINORU;NIINA KATSUTOSHI
分类号 B29C33/14;B29C45/14;B29L9/00;(IPC1-7):B29C45/14 主分类号 B29C33/14
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