A ceramic substrate pad used for establishing brazed connection between a pin and the substrate in the packaging of microelectronic semiconductor circuit chip. The pad is characterized by a stepped setback in the upper surface thereof which setback is oxidized to prevent wetting by the brazing alloy which bonds the pin to the pad. Stresses attributable to the brazing are isolated from the setback area and thus have reduced effect in causing cracking at the edges of the pad-substrate interface.
申请公布号
US5483105(A)
申请公布日期
1996.01.09
申请号
US19940233025
申请日期
1994.04.25
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
KAJA, SURYANARAYANA;PERFECTO, ERIC D.;PRICE, WILLIAM H.;PURUSHOTHAMAN, SAMPATH;REDDY, SRINIVASA N.;SURA, VIVEK M.;WHITE, GEORGE E.