发明名称 RESIN MOLDING DEVICE AND RESIN MOLDED PRODUCT
摘要 PURPOSE:To pile up molded articles flat so as to facilitate the laying-away, carrying or the like of the molded article, and further improve the releasability of the molded article. CONSTITUTION:In a resin molding device having a mold, in which a cavity 16 for molding a resin molding part offset to one side from the widthwise central position of a lead frame 10, a molding part for molding a supporting part 30, which is resinously molded integrally with the lead frame 10, is provided at the position offset to the other side from the resin molding part in the mold so as to make the projecting dimension of the whole of its to the direction of the thickness of the lead frame 10 equal to the total thickness of the resin molding part. Further, the molding part is allowed to communicate with a mold runner 20 connecting to the cavity 16.
申请公布号 JPH081707(A) 申请公布日期 1996.01.09
申请号 JP19940139759 申请日期 1994.06.22
申请人 APIC YAMADA KK 发明人 IKEDA MASANOBU
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/26
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